SRAM

UT8ER2M32 64Mb SRAM Module

64 Mb asynchronous SRAM module with 2M × 32 organization, 22 ns read access and embedded EDAC.
Density and organization
64 Mb; 2M × 32
SEL characterization
≤110 MeV·cm²/mg
Type
SRAM
Specifications

Specifications

Product specifications
Part Number UT8ER2M32
Flight Grade QML-Q, QML-V
LET (MeV·cm²/mg) ≤110
TID krad(Si) 100
Access Time 22ns
Configuration 2M x 32
Density 64Mb
Supply Voltage +2.5V
Package 132-Lead FP

Technical specifications

Specification Value Notes
Density and organization 64 Mb; 2M × 32
Read/write access 22 ns read; 10 ns write Use this density-specific option; the family feature heading does not make all densities 20 ns.
I/O and core supplies I/O: 2.3–3.6 V; core: 1.7–2.0 V
Package 132-lead side-brazed dual-cavity ceramic quad flatpack
HiRel operating range −55°C to +105°C Prototype flow is 25°C only.
SMD radiation assurance 100 krad(Si) SMD R option. Generic HiRel and prototype flows do not test or guarantee radiation.
SEL characterization ≤110 MeV·cm²/mg

Values are subject to the conditions and ordering options in the referenced product documentation.

Product overview

The UT8ER2M32 is a 64 Mb CMOS static RAM multichip module organized as 2M × 32. It combines four SRAM die in a 132-lead ceramic quad flatpack and provides 22 ns read access with 10 ns write access. Active-low chip enables, output enable and three-state drivers support memory expansion and bus control. Embedded error detection and correction supports master or slave scrubbing, with programmable scrub timing to balance data protection and memory availability. A deselected power-down mode reduces consumption while preserving stored data. Core and I/O supplies are separate, and the selected SMD ordering configuration defines radiation assurance, temperature range and quality level.

More about this product

Product features

  • Asynchronous SRAM interface
  • Separate I/O and core supplies
  • Three-state bidirectional data bus
  • Deselected power-down mode
  • Programmable EDAC scrubbing
  • Master and slave options

Programmable memory scrubbing

Embedded EDAC corrects single-bit errors presented on the output bus during reads. Core memory is rewritten only during scrub cycles, so periodic scrubbing is required to prevent accumulation of errors.

Master and slave options

Master devices initiate scrub cycles at a programmed interval. Slave devices perform a scrub cycle when requested through the SCRUB input.

Applications

  • Microprocessor memory
  • Microcontroller memory
  • FPGA memory
Product support

Discuss your application

Contact Frontgrade to discuss UT8ER2M32 64Mb SRAM Module and the requirements of your application.