SRAM

UT8R4M39 160Mb SRAM Module

160 Mb asynchronous SRAM module with 4M × 39 organization, 25 ns read access and a 39-bit data path.
SEL characterization
≤110 MeV·cm²/mg
Type
SRAM
Part
UT8R4M39
The UT8R4M39 is a 160Mb, radiation hardened by design, high performance CMOS static RAM multichip module (MCM) that is functionally compatible with traditional 4Mx39 SRAM devices.
Specifications

Specifications

Product specifications
Part Number UT8R4M39
Flight Grade QML-Q, QML-Q+
LET (MeV·cm²/mg) ≤110
TID krad(Si) 100
Access Time 25ns
Configuration 4M x 39
Density 160Mb
Supply Voltage +2.5V
Package 132-Lead FP

Technical specifications

Specification Value Notes
Density and organization 160 Mb; 4M × 39 Exact organization determines usable data width; the x39 family is marketed as 40/80/160 Mb.
Read/write access 25 ns read; 10 ns write Use this density-specific option; the family feature heading does not make all densities 20 ns.
I/O and core supplies I/O: 2.3–3.6 V; core: 1.7–2.0 V
Package 132-lead side-brazed dual-cavity ceramic quad flatpack
HiRel operating range −55°C to +105°C Prototype flow is 25°C only.
SMD radiation assurance 100 krad(Si) SMD R option. Generic HiRel and prototype flows do not test or guarantee radiation.
SEL characterization ≤110 MeV·cm²/mg

Values are subject to the conditions and ordering options in the referenced product documentation.

Product overview

The UT8R4M39 is a 160 Mb CMOS static RAM multichip module organized as 4M × 39. It combines eight SRAM die in a 132-lead ceramic quad flatpack and provides 25 ns read access with 10 ns write access. Active-low chip enables, output enable and three-state drivers support memory expansion and bus control. Its 39-bit-wide organization supports systems using external error-detection and correction logic. A deselected power-down mode reduces consumption while preserving stored data. Core and I/O supplies are separate, and the selected SMD ordering configuration defines radiation assurance, temperature range and quality level.

More about this product

Product features

  • Asynchronous SRAM interface
  • Separate I/O and core supplies
  • Three-state bidirectional data bus
  • Deselected power-down mode
  • External EDAC support

Memory expansion and bus control

Active-low chip enables, output enable and three-state drivers control individual memory die. Only one die enable may be active at a time.

Applications

  • Microprocessor memory
  • Microcontroller memory
  • FPGA memory
Product support

Discuss your application

Contact Frontgrade to discuss UT8R4M39 160Mb SRAM Module and the requirements of your application.